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TECHNICAL  CAPABILITY

Item

Capability
Layer number 1-16
Board thickness  0.2-3.2mm
Hole size Min 0.1mm
Copper  thickness Hoz、1oz、2oz、3oz、4oz
Hole wall copper 0.8-2mil
Aspect ratio Max 10:1
Laminate type FR4 / CEM1 / CEM3

High Tg FR-4

Halogen free FR-4

High CTI  laminate

Low CAF laminate

Polyimide

BT material
Surface finished HAL / Lead free HAL

OSP / ENTEK

Flash Gold

Tab plating (Contact plating)

Wire bonding soft gold

Immersion  Gold  (ENIG)

Electroless Gold  (ENEG)

Immersion Tin

Immersion Silver
Other process Carbon   Peelable mask
Solder mask Liquid photo image ink
Impedance control ±10%
Nickel plating 80-400u″
Tab plating Gold 3-60u″
Electroless Nickel 120-200u″
Immersion Gold 2-3u″
Electroless Gold 3-20u″
Wire bonding soft gold 3-20u″
Trace width /space Min 4mil/4mil
Thin core thickness Min 2mil
Dielectric thickness Min 2mil
Dimension Punch 、CNC route
V-score angle 30°、45°、60°
Chamfer angle 20°-60°
Plug hole Solder mask  ink

Resin ink
via PTH 、Blind & buried

　

　

　

　
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